This New Computer Chip Can Self Destruct In Seconds Displayed At Darpa Technology Forum
The new method utilizes silicon computer wafers attached to a piece of tempered glass, which when heated in one spot shatters into small pieces. Gregory Whiting, a materials scientist and manager of the Novel Electronics Group that produced the chip at PARC, a California-based company, said that the heat can be turned on via a remote, which could imaginably be triggered by anything from Wi-Fi to a radio frequency signal in the future....